M. Joseph Bonem Скачать все книги 3 Количество книг

Avoid wasting time and money on recurring plant process problems by applying the practical, five-step solution in Process Engineering Problem Solving: Avoiding «The Problem Went Away, but it Came Back» Syndrome. Combine cause and effect problem solving with the formulation of theoretically correct working hypotheses and find a structural and pragmatic way to solve real-world issues that tend to be chronic or that require an engineering analysis. Utilize the fundamentals of chemical engineering to develop technically correct working hypotheses that are key to successful problem solving.

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

This book provides methods to train process operators to solve challenging problems. The book is split into two parts. The first part consists of two parts; first developing a daily monitoring system and second providing a structured 5 step problem solving approach that combines cause and effect problem solving thinking with the formulation of theoretically correct hypotheses. The 5 step approach emphasizes the classical problem solving approach (defining the sequence of events) with the addition of the steps of formulating a theoretically correct working hypothesis, providing a means to test the hypothesis, and providing a foolproof means to eliminate the problem. The initial part of the book focuses on defining the problem that must be solved and obtaining the location, time and quantity based specifications of the problem. This part of the book also presents techniques to find and define problems at an early point before they progress to the critical level. The second part of the book deals with the utilization of fundamental chemical engineering skills to develop a technically correct working hypothesis that is the key to successful problem solving. The primary emphasis is on simple pragmatic calculation techniques that are theoretically correct. It is believed that any operator can perform these calculations if he is provided the correct prototype. Throughout the book, the theory behind each pragmatic calculation technique is explained in understandable terms prior to presenting the author's approach. These techniques have been developed by the author in 50+ years of industrial experience. The book includes many sample problems and examples of real world problem solving. Using these techniques, theoretically correct working hypotheses can be developed in an expedient fashion.